SOLDERING FLUX PASTE - 30 g

Product description
This product is widely used in PCB, BGA, CSP and other packaging, soldering, repair areas. All raw materials are finest, no halogen and Lead-free, the activity is good, and performance is stable. It can be used in precision soldering. The solvent added to the paste is organic and resin. The viscosity is moderate, the rheology is good.Specifications
appearance and colour: transparency liquid
odour: slightly pungent smell
pH value: 4 - 5
flammability: non combustible
density (g/cm³): 0.77-0.795
boiling point: 235-255 °C
melting point: 130-150 °C
decomposition temperature: does not decompose easily
solubility: insoluble in water
weight: 30 g